Notes

Process Integration for VLSI Circuits

Introduction

Technology review

Review of fabrication processes

 

MOS Devices and scaling challenges

 Part1 Part II

CMOS process integration

Part 1 (gates) Part II (dielectrics and channels) Part 1II (junctions and contacts) Part IV (Process Flow) Part 1V (SOI and FINFETs)

Bipolar and BICMOS Process Integration

 Part1 Part II

Semiconductor Memories

 Part1 Part II

Back End processes; Multilayer Interconnect technology for VLSI  

Part 1 Part II

Emerging devices and emerging materials

Projections

 

 

 

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