Research topics suggested for the paper and presentation

 

There are many other topics that are related to process integration. Please stay with Si based devices. 

1. BiCMOS process flows; material constrains
2. Current bipolar transistors; constrains related to materials and devices
3. Interconnect conductors and plugs; current choices and constrains.
4. Barriers and caping layers for metallization
5. Dielectrics and stoping layers; processing of interconnects
6. DRAMS; current materials and designs.
7. SOI devices: fully vs partially depleted? Performance and integration issues.
8. SOI wafers; fabrication processes
9. Contacts for MOS transistors n- and p-type. Requirements and solutions
10. Schottky S/D; concept and realizaiton
11. New doping processes for S/D regions.
12. Fabrication and design of S/D in FinFets
13. Band-Engineering in MOSFET.
14. Ultra Thin SOI devices, issues in fabrication and operation
15. 3D Integration; concept and realization.
16. Current optical lithography solutions; multiple exposures.
17. Non-Volatile Memory (Flash). Problem with scaling.
18. Ferroelectric Random Access Memory (FeRAM). New materials and integration issues.
19. Issues in high-K dielectrics
20. Issues in metal gates technology
21. Thermal conductivity of materials in Front End Processes and back end of line.
22. Band Gap Engineering in MOSFETs
23. Scaling and Vt variations
24. Solutions for mobility enhancement based on orientation; process flow

 

Other relevant topics of you choice are acceptable.