Notes Process Integration for VLSI CircuitsIntroductionTechnology review
Review of fabrication processes
MOS Devices and scaling challenges
Part1 Part IICMOS process integration
Part 1 (gates) Part II (dielectrics and channels) Part 1II (junctions and contacts) Part IV (Process Flow) Part 1V (SOI and FINFETs)Bipolar and BICMOS Process Integration
Part1 Part IISemiconductor Memories
Part1 Part IIBack End processes; Multilayer Interconnect technology for VLSI
Part 1 Part IIEmerging devices and emerging materials
Projections
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